Scientists from the Johann Kepler University in Linz have made a biodegradable substrate for a computer chip from the skin of a fungus. The results were published in the journal Science Advances.
The authors tested several fungal species. It turned out to be the most suitable Ganoderma lucidumgrows on a rotting tree. It forms a shell that protects it from foreign bacteria and other fungi.
Scientists separated and dried this bark. It turns out that it is not only flexible, but also a good insulator and can withstand temperatures above 200 degrees Celsius. Its thickness is not more than a sheet of paper. These properties make it an excellent substrate material for microcircuits.
In one test sample, the metal chains on the cork skin transmitted signals almost as well as standard plastic polymers. The liner remained effective even after being twisted more than two thousand times. Researchers have already proven that it can run on a battery for low-power devices like Bluetooth sensors.
Standard insulation pads are made from plastic that is difficult to recycle. They usually end up in a landfill. In total, 50 million tons of electronic waste is accumulated annually.
Now, the scientists plan to test the possibility of using a cork substrate in wearable devices. According to the authors, the device based on a cork computer chip can last for hundreds of years if stored away from moisture and ultraviolet radiation. It will also decompose in the soil in just a few weeks.
Source: Port Altele
